Mobile Snapdragon 810 Often Heat? Try Mute Use Aluminum Foil - Controversy overheating of Snapdragon 810 seems to have become one of the main factors of the decline in revenue Qualcomm in the last period. If at this time you've already bought an Android phone that uses the chipset, not to worry too much and in a hurry to sell it back, because there is a very easy way to suppress the potential problems of excessive heat when you boost the performance of your phone.
Before going further, we should simplify the problems arising on the phone with a Snapdragon chipset 810. As you know, 810 Snapdragon chips are prone to blockage performance because of the high heat generated. Therefore, to reduce the heat that arises and makes the chipset more stable and not severely blocked, then you need to do is to present a larger heat sink.
By using this approach, a member of the forum XDA developer with ID Schecter 7 was immediately initiated to coat the innards of the phone Xperia Z3 + hers with aluminum foil that serves as a heat sink at the same time spreading the heat there to all parts of the phone (not concentrated at one point around the site chipset).
The result? This trick proved capable of lowering the temperature of the phone between 1-2 ° C and increases performance up to 5%. Even more exciting again, a member of another forum reported that he was inspired by this trick and try to use copper foil that proved able to bring better results.
Even if the decrease in temperature and increase in performance is not a significant amount, but this trick proved to be very easy and can be done by anyone. But what should be noted is this way also has the potential to affect the arrest of cellular and WiFi signals, so it's good for you to review in advance whether you really need it or not.
If you're curious to try it out, just visit his page thread at XDA forums.
Before going further, we should simplify the problems arising on the phone with a Snapdragon chipset 810. As you know, 810 Snapdragon chips are prone to blockage performance because of the high heat generated. Therefore, to reduce the heat that arises and makes the chipset more stable and not severely blocked, then you need to do is to present a larger heat sink.
By using this approach, a member of the forum XDA developer with ID Schecter 7 was immediately initiated to coat the innards of the phone Xperia Z3 + hers with aluminum foil that serves as a heat sink at the same time spreading the heat there to all parts of the phone (not concentrated at one point around the site chipset).
The result? This trick proved capable of lowering the temperature of the phone between 1-2 ° C and increases performance up to 5%. Even more exciting again, a member of another forum reported that he was inspired by this trick and try to use copper foil that proved able to bring better results.
Even if the decrease in temperature and increase in performance is not a significant amount, but this trick proved to be very easy and can be done by anyone. But what should be noted is this way also has the potential to affect the arrest of cellular and WiFi signals, so it's good for you to review in advance whether you really need it or not.
If you're curious to try it out, just visit his page thread at XDA forums.